Sensors, ASA(ALT), Direct to Phase II
Advanced Miniature Mission Processor for Hyperspectral Applications
Selectees
Objective
The Army wants to develop a computer prototype to meet the necessary Size, Weight, and Power requirements for integration into various ongoing modernization programs. The technology should be a low-SWaP, high-performance computer for an Unmanned, Aircraft Systems-integrated hyperspectral imaging camera.
Description
The onboard capabilities for payload command, control and processing data from airborne HSI systems have historically required large custom solutions needing extensive power and thermal management. These units are purpose-built and inflexible to modification or scaling, making component and payload changes costly and time-consuming. These technologies are also prohibitive due to integral dependencies and a lack of alternative sensor/payload options.
To address these challenges, the mission processor must work with the current Sensor Open System Architecture, Small Form Factor standards. The technology must also demonstrate substantial reductions in weight, power and volume while reducing costs from legacy systems and improving flexibility integration with other payloads. Finally, the mission processor will aggregate multiple core payload operation functions that have traditionally required separate modules. The vendors will receive the exact functional details/specifications upon award.
Phase I
The Army will only accept Direct to Phase II proposals for potential contracts valued up to $2 million for a 24-month performance period. Interested vendors must provide documentation substantiating that the technology’s scientific, technical merit and feasibility are equivalent to a Phase I project. The documentation can include data, reports, specific measurements and the success criteria of a prototype.
Phase II
- Complete the component design.
- Fabricate, evaluate and characterize the component using simulated data streams to show that it can integrate into a Class II or smaller UAS platform.
- Refine the design as necessary and iteratively refabricate and retest, if appropriate.
- Define and document relevant interfaces to enable integration.
- Lay out a high-level plan for how your component could integrate into a Class II or smaller UAS platform while exploring transition partners.
Phase III
Vendors must integrate the sensor/gimbal payload into a prototype system for field collection. Vendors should also deploy the sensor on at least one test event to observe its performance and generate quantitative/qualitative sensor performance data.
Submission Information
All eligible businesses must submit proposals by noon, ET.
To view the full solicitation details, click here.
For more information, and to submit your full proposal package, visit the DSIP Portal.
Applied SBIR Help Desk: usarmy.pentagon.hqda-asa-alt.mbx.army-applied-sbir-program@army.mil
References:
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Y. -C. Lo, Y. -C. Wu and C. -H. Yang, “A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing,” 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA, 2022, pp. 74-75, doi: 10.1109/VLSITechnologyandCir46769.2022.9830370. URL: https://ieeexplore.ieee.org/document/9830370
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D. Manolakis, S. Golowich and R. S. DiPietro, “Long-Wave Infrared Hyperspectral Remote Sensing of Chemical Clouds: A focus on signal processing approaches,” in IEEE Signal Processing Magazine, vol. 31, no. 4, pp. 120-141, July 2014, doi: 10.1109/MSP.2013.2294804. URL: https://ieeexplore.ieee.org/document/6832769
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M. Shimoni, R. Haelterman and C. Perneel, “Hypersectral Imaging for Military and Security Applications: Combining Myriad Processing and Sensing Techniques,” in IEEE Geoscience and Remote Sensing Magazine, vol. 7, no. 2, pp. 101-117, June 2019, doi: 10.1109/MGRS.2019.2902525. URL: https://ieeexplore.ieee.org/document/8738016
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Hyperspectral, Real-Time Processor, Near-Real-Time Processor, Mission Processor.
Selectees
Objective
The Army wants to develop a computer prototype to meet the necessary Size, Weight, and Power requirements for integration into various ongoing modernization programs. The technology should be a low-SWaP, high-performance computer for an Unmanned, Aircraft Systems-integrated hyperspectral imaging camera.
Description
The onboard capabilities for payload command, control and processing data from airborne HSI systems have historically required large custom solutions needing extensive power and thermal management. These units are purpose-built and inflexible to modification or scaling, making component and payload changes costly and time-consuming. These technologies are also prohibitive due to integral dependencies and a lack of alternative sensor/payload options.
To address these challenges, the mission processor must work with the current Sensor Open System Architecture, Small Form Factor standards. The technology must also demonstrate substantial reductions in weight, power and volume while reducing costs from legacy systems and improving flexibility integration with other payloads. Finally, the mission processor will aggregate multiple core payload operation functions that have traditionally required separate modules. The vendors will receive the exact functional details/specifications upon award.
Phase I
The Army will only accept Direct to Phase II proposals for potential contracts valued up to $2 million for a 24-month performance period. Interested vendors must provide documentation substantiating that the technology’s scientific, technical merit and feasibility are equivalent to a Phase I project. The documentation can include data, reports, specific measurements and the success criteria of a prototype.
Phase II
- Complete the component design.
- Fabricate, evaluate and characterize the component using simulated data streams to show that it can integrate into a Class II or smaller UAS platform.
- Refine the design as necessary and iteratively refabricate and retest, if appropriate.
- Define and document relevant interfaces to enable integration.
- Lay out a high-level plan for how your component could integrate into a Class II or smaller UAS platform while exploring transition partners.
Phase III
Vendors must integrate the sensor/gimbal payload into a prototype system for field collection. Vendors should also deploy the sensor on at least one test event to observe its performance and generate quantitative/qualitative sensor performance data.
Submission Information
All eligible businesses must submit proposals by noon, ET.
To view the full solicitation details, click here.
For more information, and to submit your full proposal package, visit the DSIP Portal.
Applied SBIR Help Desk: usarmy.pentagon.hqda-asa-alt.mbx.army-applied-sbir-program@army.mil
References:
-
Y. -C. Lo, Y. -C. Wu and C. -H. Yang, “A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing,” 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA, 2022, pp. 74-75, doi: 10.1109/VLSITechnologyandCir46769.2022.9830370. URL: https://ieeexplore.ieee.org/document/9830370
-
D. Manolakis, S. Golowich and R. S. DiPietro, “Long-Wave Infrared Hyperspectral Remote Sensing of Chemical Clouds: A focus on signal processing approaches,” in IEEE Signal Processing Magazine, vol. 31, no. 4, pp. 120-141, July 2014, doi: 10.1109/MSP.2013.2294804. URL: https://ieeexplore.ieee.org/document/6832769
-
M. Shimoni, R. Haelterman and C. Perneel, “Hypersectral Imaging for Military and Security Applications: Combining Myriad Processing and Sensing Techniques,” in IEEE Geoscience and Remote Sensing Magazine, vol. 7, no. 2, pp. 101-117, June 2019, doi: 10.1109/MGRS.2019.2902525. URL: https://ieeexplore.ieee.org/document/8738016
-
Hyperspectral, Real-Time Processor, Near-Real-Time Processor, Mission Processor.