Sensors, ASA(ALT), Direct to Phase II
Low-Cost Longwave Bolometer Camera Fabrication Techniques
Objective
The Army seeks to develop novel technologies and fabrication techniques that can reduce the cost of sensor payloads based on resistive microbolometer technology.
Description
Thermal longwave infrared capabilities are crucial to Army applications. However, the cost of high-resolution sensors is prohibitive and often forces the Army to use less capable payloads. To address this challenge, the Army requests vendors develop a thermal sensor payload with a comparable size, weight, power and performance to current commercial offerings, while also providing a high-definition array and dramatically reduced unit price.
Firms could accomplish this by using novel manufacturing techniques, new materials systems, innovative components or modular designs. In turn, U.S. Army Small Business Innovation Research Direct to Phase II contracts will focus on the demonstration of these capabilities. Meanwhile, Phase II sequential efforts will prioritize the delivery of a payload prototype that meets evaluation requirements by Army Unmanned Aircraft Systems or other programs.
Phase I
The Army will only accept Army SBIR Direct to Phase II proposals for a cost up to $2,000,000 for a 24-month performance period.
Phase II
The Army highly encourages DP2 proposals to businesses that have solutions meeting the following requirements. Vendors must show through modeling, simulation or other appropriate methods the estimated cost reduction compared with products made using current fabrication techniques or technologies. During the performance period, firms must:
- Discuss the impact on size, weight and power of a complete camera module.
- Detail how they will support the desired camera module or payload.
- Discuss initial ideas on potential paths for integration of the proposed solution into a production camera module.
- Design and fabricate a prototype device that demonstrates the proposed solution to reduce the thermal sensor payload unit cost.
- Discuss the impact of the solution on the unit price of a final sensor payload, which meets this topic’s specification and how the solution can incorporate into such a payload.
- Define and document relevant interfaces, if appropriate.
- Consider the required partnerships with integrators or other companies to design and fabricate the payload in a potential follow-on effort.
Phase III
- Leveraging bolometer manufacturing methods for LWIR sensors has proven efficacious via academic research.
- Additionally, research at the University of Chicago has shown the efficacy of leveraging colloidal quantum dots as a cheap way to make IR light sensing. However, it is still quite nascent and academic in nature. Per the International Institute for Strategic Studies, China and Japan lead QD sensing development.
- Military contractors, like BAE Systems and L3Harris, have driven the research and development within the LWIR sensor and bolometer manufacturing spaces.
- Potential dual uses of remote LWIR sensing include:
- Cheap smartphone camera augmentation.
- UAV camera augmentation, specifically via the Office of Naval Research.
- Home security systems.
- Climate tech via QD development.
Submission Information
All eligible businesses must submit proposals by noon, ET.
To view full solicitation details, click here.
For more information, and to submit your full proposal package, visit the DSIP Portal.
SBIR|STTR Help Desk: usarmy.sbirsttr@army.mil
References:
- https://doi.org/10.1117/12.2666249
- https://patents.google.com/patent/US20140267756A1/en
- https://iopscience.iop.org/article/10.1088/1674-1056/ac4026
- UAS; Thermal Longwave Infrared; LWIR; Sensors; Bolometer; Weight; Payload; Focal Plane Array
Objective
The Army seeks to develop novel technologies and fabrication techniques that can reduce the cost of sensor payloads based on resistive microbolometer technology.
Description
Thermal longwave infrared capabilities are crucial to Army applications. However, the cost of high-resolution sensors is prohibitive and often forces the Army to use less capable payloads. To address this challenge, the Army requests vendors develop a thermal sensor payload with a comparable size, weight, power and performance to current commercial offerings, while also providing a high-definition array and dramatically reduced unit price.
Firms could accomplish this by using novel manufacturing techniques, new materials systems, innovative components or modular designs. In turn, U.S. Army Small Business Innovation Research Direct to Phase II contracts will focus on the demonstration of these capabilities. Meanwhile, Phase II sequential efforts will prioritize the delivery of a payload prototype that meets evaluation requirements by Army Unmanned Aircraft Systems or other programs.
Phase I
The Army will only accept Army SBIR Direct to Phase II proposals for a cost up to $2,000,000 for a 24-month performance period.
Phase II
The Army highly encourages DP2 proposals to businesses that have solutions meeting the following requirements. Vendors must show through modeling, simulation or other appropriate methods the estimated cost reduction compared with products made using current fabrication techniques or technologies. During the performance period, firms must:
- Discuss the impact on size, weight and power of a complete camera module.
- Detail how they will support the desired camera module or payload.
- Discuss initial ideas on potential paths for integration of the proposed solution into a production camera module.
- Design and fabricate a prototype device that demonstrates the proposed solution to reduce the thermal sensor payload unit cost.
- Discuss the impact of the solution on the unit price of a final sensor payload, which meets this topic’s specification and how the solution can incorporate into such a payload.
- Define and document relevant interfaces, if appropriate.
- Consider the required partnerships with integrators or other companies to design and fabricate the payload in a potential follow-on effort.
Phase III
- Leveraging bolometer manufacturing methods for LWIR sensors has proven efficacious via academic research.
- Additionally, research at the University of Chicago has shown the efficacy of leveraging colloidal quantum dots as a cheap way to make IR light sensing. However, it is still quite nascent and academic in nature. Per the International Institute for Strategic Studies, China and Japan lead QD sensing development.
- Military contractors, like BAE Systems and L3Harris, have driven the research and development within the LWIR sensor and bolometer manufacturing spaces.
- Potential dual uses of remote LWIR sensing include:
- Cheap smartphone camera augmentation.
- UAV camera augmentation, specifically via the Office of Naval Research.
- Home security systems.
- Climate tech via QD development.
Submission Information
All eligible businesses must submit proposals by noon, ET.
To view full solicitation details, click here.
For more information, and to submit your full proposal package, visit the DSIP Portal.
SBIR|STTR Help Desk: usarmy.sbirsttr@army.mil
References:
- https://doi.org/10.1117/12.2666249
- https://patents.google.com/patent/US20140267756A1/en
- https://iopscience.iop.org/article/10.1088/1674-1056/ac4026
- UAS; Thermal Longwave Infrared; LWIR; Sensors; Bolometer; Weight; Payload; Focal Plane Array